EZ Amp - an op-amp experimenter board

The EZ Amp provides a convenient manner in which to experiment with operational amplifiers and to prototype circuit applications using them. Circuit patterns are provided for mounting op-amps that use a 14-pin DIP package. This includes a very large selection of standard part types.

In electronic prototyping, it is convenient to have the use of some mechanism to add circuits in a non-permanent manner, for testing. There exist many so-called “prototyping boards”, consisting of a sea of push-pin contacts that allow a circuit to be built in a very temporary manner.

Although prototyping boards are useful tools, they do not provide suitable connections for sensitive circuits involving amplifiers. Poor quality contacts and long lead wires may negatively affect the performance of the circuit. Even when the prototyping board provides adequate technical performance, it is not acceptable for inclusion as a design element for higher level prototyping.

The EZ-Amp provides a new step between “haywiring” and the final circuit. It can be used to breadboard multiple channels of analog signal conditioning in a manner suitable for all but the final step of packaging.

See more product details at http://www.eiconnect.com/product_detail.aspx?b=7

ATV1010 - a full-featured DAQ computer packaged in a 28-pin skinny-DIP

Electronic Interconnect presents ATV1010 - a complete, stand-alone stored program control computer on a chip. It requires no external components for full operation.

ATV1010 consists of a high speed micro-controller capable of executing up to 8 MOPS (million operations per second) with no external support. The speed can be increased to 16 MOPS by the addition of an external crystal or external clock source.

ATV1010 has on-board FLASH memory, EEPROM, RAM, 8 MHz oscillator, high speed UART, two high speed serial communications channels, 23 programmable input/output ports, counter/timers, PWM output channels, six channels of 10-bit analog to digital converters, an analog comparator, internal and external interrupts and everything necessary to implement a wide variety of high performance control and monitoring circuits.

See the product details at http://www.eiconnect.com/product_detail.aspx?b=10

Protect-R-Shield - Maximum protection for LED and PCB

Protect-R-Shield automated conformal coating process applies a clear, flexible, non-yellowing silicone onto printed circuit boards and LED components.

The fully automated Protect-R-Shield application process is extremely versatile. The coating can be applied to different types of printed circuit boards regardless of shape, size or the number and type of board components.

Coated boards are inspected for proper thickness and adhesion per customer specification and IPC-TM-650 guidelines and are visually inspected using a high-power video microscope.

Read more at http://www.eiconnect.com/industrial_link_detail.aspx?b=1 

Electronic Interconnect offers an Engineering Service in designing a multilayered controlled-impedance stackup

Advancements in technology have driven PCB Designers & Engineers to seek improvements in system development & develop strategies to overcome signal communication issues. To this end, it has become increasingly evident that a solid & sound PCB design can greatly mitigate such issues and ultimately lead to better signal integrity.

If your design requires specific impedance properties, for example a differential impedance of 90 ohms, & you need to design the PCB which can meet this criteria, then you'll need to investigate & calculate the best trace-width, trace-space, layer-to-layer spacing, as well as which PCB materials should be used.

We are taking this opportunity to announce that Electronic Interconnect has begun providing an Engineering Service in designing a multilayered controlled-impedance stackup to fit your design targets. You can either consult us before starting the design or if you've already finished the PCB Layout, then we can take the information from your Gerber data & design a stackup to meet the desired impedance goals. Our extensive PCB fabrication knowledge coupled with the awareness of our shops tolerances helps us deliver stackup solutions which can best fit your controlled-impedance designs. To learn more, please visit http://www.eiconnect.com/techarticle_detail.aspx?b=10

PowerLink PLPCB for Thermal Management Applications

Electronic Interconnect (EI), a leading manufacturer of printed circuit boards and provider of PCB engineering and design services, announces the availability of Powerlink PLPCB constructions for electronic assemblies where thermal management (heat dissipation) capabilities are desired.

PowerLink technology enables power and control circuits, both heavy copper and standard copper, to reside on the same layer with interconnection between the circuits. Bus bars with multi-copper weights handle the heat dissipation in the PCB, enabling extended PCB life and safety in overall functioning. The bus bars allow heat to dissipate more efficiently due to their high surface area to cross-sectional area ratio.

Read more at http://www.eiconnect.com/pressrelease_detail.aspx?b=35

Electronic Interconnect offers numerous solutions for tackling the thermal related challenges in PCB

Whatever may be the type of PCB, Electronic Interconnect offers numerous solutions for tackling the thermal related challenges in PCB's.
Many industry articles and white papers on thermal management are available to registered users at http://www.eiconnect.com/thermal_management.aspx

Electronic Interconnect Offers Direct Thermal Exchange (DTE) Configurations for LED Assemblies

Direct Thermal Exchange (DTE) design in printed circuit boards intended for LED arrays provides a direct thermal path to the base metal of the assembly, allowing the high-power LEDs to dissipate heat effectively, extending their working life and safety in overall functioning.

Electronic Interconnect (EI), a leading provider of printed circuit boards and PCB engineering and design services, now offers Direct Thermal Exchange for LEDs. Thermal Management designs and engineering are an area of specialization and focus for EI.

“DTE enables a very fast rather of thermal transfer through the LTE pad,” Pratish Patel, President, said in making the announcement. “This is an important enabling technology for LED-bearing circuits, especially those intended for outdoor lighting and emergency vehicles where heat dissipation is an ever-increasing concern as the technology of high-power LEDs advances.”
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