Electronic Interconnect (EI), a leading manufacturer of printed circuit boards and provider of PCB engineering and design services, announces the availability of Powerlink PLPCB constructions for electronic assemblies where thermal management (heat dissipation) capabilities are desired.
PowerLink technology enables power and control circuits, both heavy copper and standard copper, to reside on the same layer with interconnection between the circuits. Bus bars with multi-copper weights handle the heat dissipation in the PCB, enabling extended PCB life and safety in overall functioning. The bus bars allow heat to dissipate more efficiently due to their high surface area to cross-sectional area ratio.
Read more at http://www.eiconnect.com/pressrelease_detail.aspx?b=35
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