ATV1010 - a full-featured DAQ computer packaged in a 28-pin skinny-DIP

Electronic Interconnect presents ATV1010 - a complete, stand-alone stored program control computer on a chip. It requires no external components for full operation.

ATV1010 consists of a high speed micro-controller capable of executing up to 8 MOPS (million operations per second) with no external support. The speed can be increased to 16 MOPS by the addition of an external crystal or external clock source.

ATV1010 has on-board FLASH memory, EEPROM, RAM, 8 MHz oscillator, high speed UART, two high speed serial communications channels, 23 programmable input/output ports, counter/timers, PWM output channels, six channels of 10-bit analog to digital converters, an analog comparator, internal and external interrupts and everything necessary to implement a wide variety of high performance control and monitoring circuits.

See the product details at http://www.eiconnect.com/product_detail.aspx?b=10

Protect-R-Shield - Maximum protection for LED and PCB

Protect-R-Shield automated conformal coating process applies a clear, flexible, non-yellowing silicone onto printed circuit boards and LED components.

The fully automated Protect-R-Shield application process is extremely versatile. The coating can be applied to different types of printed circuit boards regardless of shape, size or the number and type of board components.

Coated boards are inspected for proper thickness and adhesion per customer specification and IPC-TM-650 guidelines and are visually inspected using a high-power video microscope.

Read more at http://www.eiconnect.com/industrial_link_detail.aspx?b=1 

Electronic Interconnect offers an Engineering Service in designing a multilayered controlled-impedance stackup

Advancements in technology have driven PCB Designers & Engineers to seek improvements in system development & develop strategies to overcome signal communication issues. To this end, it has become increasingly evident that a solid & sound PCB design can greatly mitigate such issues and ultimately lead to better signal integrity.

If your design requires specific impedance properties, for example a differential impedance of 90 ohms, & you need to design the PCB which can meet this criteria, then you'll need to investigate & calculate the best trace-width, trace-space, layer-to-layer spacing, as well as which PCB materials should be used.

We are taking this opportunity to announce that Electronic Interconnect has begun providing an Engineering Service in designing a multilayered controlled-impedance stackup to fit your design targets. You can either consult us before starting the design or if you've already finished the PCB Layout, then we can take the information from your Gerber data & design a stackup to meet the desired impedance goals. Our extensive PCB fabrication knowledge coupled with the awareness of our shops tolerances helps us deliver stackup solutions which can best fit your controlled-impedance designs. To learn more, please visit http://www.eiconnect.com/techarticle_detail.aspx?b=10

PowerLink PLPCB for Thermal Management Applications

Electronic Interconnect (EI), a leading manufacturer of printed circuit boards and provider of PCB engineering and design services, announces the availability of Powerlink PLPCB constructions for electronic assemblies where thermal management (heat dissipation) capabilities are desired.

PowerLink technology enables power and control circuits, both heavy copper and standard copper, to reside on the same layer with interconnection between the circuits. Bus bars with multi-copper weights handle the heat dissipation in the PCB, enabling extended PCB life and safety in overall functioning. The bus bars allow heat to dissipate more efficiently due to their high surface area to cross-sectional area ratio.

Read more at http://www.eiconnect.com/pressrelease_detail.aspx?b=35

Electronic Interconnect offers numerous solutions for tackling the thermal related challenges in PCB

Whatever may be the type of PCB, Electronic Interconnect offers numerous solutions for tackling the thermal related challenges in PCB's.
Many industry articles and white papers on thermal management are available to registered users at http://www.eiconnect.com/thermal_management.aspx

Electronic Interconnect Offers Direct Thermal Exchange (DTE) Configurations for LED Assemblies

Direct Thermal Exchange (DTE) design in printed circuit boards intended for LED arrays provides a direct thermal path to the base metal of the assembly, allowing the high-power LEDs to dissipate heat effectively, extending their working life and safety in overall functioning.

Electronic Interconnect (EI), a leading provider of printed circuit boards and PCB engineering and design services, now offers Direct Thermal Exchange for LEDs. Thermal Management designs and engineering are an area of specialization and focus for EI.

“DTE enables a very fast rather of thermal transfer through the LTE pad,” Pratish Patel, President, said in making the announcement. “This is an important enabling technology for LED-bearing circuits, especially those intended for outdoor lighting and emergency vehicles where heat dissipation is an ever-increasing concern as the technology of high-power LEDs advances.”
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IPC-1601, Standard on Handling, Packaging and Storage of Printed Boards

IPC-1601 provides users with guidance on how to protect printed circuit board from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake. The document covers all phases of production, from the manufacture of the bare printed board, through delivery, receiving, stocking, and soldering. It also gives needed attention to helping users with moisture concerns. The following information provides guidance on establishing recommended moisture levels and baking profiles for moisture removal, and covers the impact of baking on printed board solderability. Moisture absorbed in printed board laminates expands at soldering temperatures, and in some cases the resulting vapor pressure can cause internal delamination or excessive strain on plated-hole walls and other structures. This is especially challenging with the higher temperatures used for lead-free soldering. The costs associated with having too much moisture in a board can be significant. System manufacturers note that if moisture causes problems and ruins boards after parts have been installed, failures can have major repercussions. For information please visit to www.ipc.org.

• The transition to lead-free soldering of printed circuit boards has resulted in a peak reflow and wave soldering temperature increase of 30-40° C for a longer period of time during assembly compared to leaded solder technology.

• These high temperature exposures associated with lead-free soldering assembly conditions result in variations in the circuit board material properties, therefore creating a shift in the expected reliability of the board. This may increase the effect of the moisture that may be absorbed by the base materials; the moisture reduces glass transition temperature of the base material which in turn increases stresses on PCB features and can cause blistering or inner layer delamination.

• IPC standard highly recommends that, baking of the boards prior to assembly is needed to remove the moisture that can be absorbed into PCB; the baking oven is to be set below the maximum operating temperature and glass transition temperature but above 100° C; the baking time should be selected based on the boards features, such as PCB complexity, overall thickness, and PCB finish; it is also recommended that baking be performed in a forced air recirculating oven; it is important to insure proper venting and cleanliness of the oven and sufficient gaps between boards; the boards should never be high stacked inside of the baking oven.