Expert Printed Circuit Board Thermal Management and Metal Cladding
Electronic Interconnect – The PCB Experts
Electronic Interconnect is a
reliable manufacturer of high quality PCBs – up to Class 3. We specialize in and focus on the design and manufacture of PC boards.
With nearly 30 years of experience, our customers have benefited from our unique technical advancements and distinct advantages, such as thermal management, use of metal cladding, heavy copper and outstanding solder-ability.
Effective Use of Thermal Management
Today, many PCB materials, constructions, and configurations for electronic assemblies require special thermal management to ensure continued operation without excessive heat issues, such as
- Hot spots
- CTE mismatch
- Solder joint stress
- Thermal fatigue failure
- Shock and vibration issues
While thermal management is important for any electronic assembly that is smaller, faster and stronger, it has become a critical part of
PCB design for:
- High-power devices
- RF and wireless applications
- LED lighting boards
- DC/DC converters
- Electric motor controls
Thermal Management Expertise
As PCB specialists, we have become experts in the use of metals and Thermal Management. As a result, our PCBs exhibit faster heat dissipation, longer life and reduced energy needs. Our heat management capabilities include UL-certified metal-clad PCBs with various thicknesses of dielectrics and metal bases, such as aluminum and copper.
Materials Expertise
The combination of our knowledge and dedication to
thermal management in PCBs, our expert processes and the use of many thermal laminates, allow us to optimize the performance and reliability of metal clad PCBs and provide the best solution to our customers. We manufacture boards with optional metal bases, provide metal cladding and use heavy copper weights.
Electronic Interconnect offers design counseling services to support the Thermal Management program.
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| Electronic Interconnect specializes in Thermal Management PCBs with broad capabilities in design and manufacturing. |
Metal Clad PCB (MCPCB) Capabilities
The use of heavy metal and metal cladding is critical to effective thermal management of PCBs. Electronic Interconnect has very deep experience and broad capabilities in this area of specialization.
- Heavy copper capabilities up to 10 oz.
- UL approved MCPCBs up to 6 oz.
- Metal thickness from 30 mil to 125 mil
- Solder masks with high reflectance
- RoHS compliant
- Multi-layer and hybrid FR4 construction
- Many construction options
Flexi-Thermal PCBs
Often called Conformable MCPCBs.
- Metal Core PCBs (MCPCBs) from 0.004”
- Breakdown voltage AC from 2.5Kv to 10Kv
- External/internal radius up to 60°
- Extremely low thermal impedance
- Halogen-free, RoHS compliant
Direct Thermal Exchange (DTE)
With DTE technology, the thermal conduction path operates efficiently as a heat sink.
- Direct thermal conduction path
- Heat dissipates through Z axis
- No thermal transfer through the dielectric
- Resistant to UV and thermal discoloration
- Low thermal impedance
- 135W to 300W/mK conduction achieved
- Fast heat transfer rate through DTE pad
- Utilizes any base metal thickness
- Utilizes standard dielectric for the circuit area
- Utilizes FR4 epoxy, polyimide or any typical dielectric
- Other base metals available
- High power capacity
- No thermal via required
PowerLink PCBs (PLPCBs) with Heavy Copper
There are multiple benefits of PLPCBs, ranging from smaller PCB size to extended life. They utilize a minimum of two copper weights on the same layer for the buss bar application.
- UL approved up to 6 oz.; capabilities to 20 oz.
- Use of multiple copper weights on same FR4 plane
- Prevents circuit failure
- Reduces number of connectors required
- Increases mechanical strength
- Higher current carrying capacity
- Use of high temperature dielectric material
Fabrication for Thermal Management
Precise machining tolerances and high-quality fabrication services at Electronic Interconnect enhance thermal management and long-term board reliability. A variety of laminates are available, based on the T-lam thermal lamination system, which includes:
1. Single side with a thermally conductive dielectric.
2. Double-sided with a thermally conductive dielectric on two sides of metal base.
3. Hybrid IMPCBs with FR-4 and a thermally conductive dielectric
4. Multi-layer construction with FR-4 and thermally conductive dielectrics on the metal base.
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| Electronic Interconnect uses advanced thermal management technologies to create PCBs for a wide variety of applications, such as LED lighting and power inverters. |
The materials used feature strong thermal performance with high dielectric strength and low capacitance. They can eliminate the need for fans, heat sinks, and heat spreaders.
Download the PDF Brochure on Printed Circuit Board Thermal Management
