Friday, August 16, 2013

Electronic Interconnect offers an Engineering Service in designing a multilayered controlled-impedance stackup

Advancements in technology have driven PCB Designers & Engineers to seek improvements in system development & develop strategies to overcome signal communication issues. To this end, it has become increasingly evident that a solid & sound PCB design can greatly mitigate such issues and ultimately lead to better signal integrity.

If your design requires specific impedance properties, for example a differential impedance of 90 ohms, & you need to design the PCB which can meet this criteria, then you'll need to investigate & calculate the best trace-width, trace-space, layer-to-layer spacing, as well as which PCB materials should be used.

We are taking this opportunity to announce that Electronic Interconnect has begun providing an Engineering Service in designing a multilayered controlled-impedance stackup to fit your design targets. You can either consult us before starting the design or if you've already finished the PCB Layout, then we can take the information from your Gerber data & design a stackup to meet the desired impedance goals. Our extensive PCB fabrication knowledge coupled with the awareness of our shops tolerances helps us deliver stackup solutions which can best fit your controlled-impedance designs. To learn more, please visit http://www.eiconnect.com/techarticle_detail.aspx?b=10

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